Next-Generation AI Infrastructure

The Thermal Intelligence
Layer for AI Infrastructure

AI data centers are hitting a wall, not a compute wall, but a thermal wall. Datafabrix builds the thermal-aware interconnect hardware that makes 150kW+ AI rack densities not just possible, but reliable.

150kW Rack Density Supported
64 GT/s PAM4 Signal Integrity
40% PUE Reduction

AI Has a Thermal Barrier.
We Break It.

The Density Wall

AI server racks have gone from 10kW to 120kW in just three years. Traditional air-cooled backplanes fail under this load.

120kW ↑ Average Density

The Signal Crisis

Heat destroys signal integrity at 64 GT/s. Elevated temperatures cause bit error rates to skyrocket.

10x BER per 10°C

The Energy Waste

40% of data center power is wasted on cooling. Inefficient interconnects are the hidden cost multiplier.

40% Power Wasted

Hardware That Thinks
About Heat First

Datafabrix does not bolt thermal management onto existing designs. We start with heat. Every trace, every via, every connector interface is co-optimized for both electrical performance and thermal conductivity simultaneously, from day one.

The result: interconnect hardware that runs cooler, faster, and longer than anything else on the market, validated to PCIe Gen6 specification at 85°C operating temperature.

01
Thermal-First PCB Design
Embedded microfluidic channels and ultra-low-loss Megtron 8 laminates in the substrate core.
02
Embedded Thermal Intelligence
ThermalSense MCUs monitor flux at every junction, feeding real-time data to ThermalOS.
03
Open Standards Ready
Native PCIe Gen6, CXL 3.0, UALink 200G, and co-packaged optics to future-proof your investment.

The Complete Thermal-Aware
Interconnect Stack

The Thermal-Aware Architecture Stack

GPU / CPU
1000W TDP
PCB Substrate
Megtron 8 Core
Liquid Channel
D2C Cooling
ThermalSense
Edge AI MCU
ThermalOS
SaaS Platform
Heat Source
Thermal Management
Intelligence Layer

Building for a $200B+
Infrastructure Wave

Goldman Sachs projects a 165% increase in data center power demand by 2030. Every watt needs to be managed.

$2.6B
PCIe Retimer Market
34.6% CAGR
$15.7B
Liquid Cooling Market
18.2% CAGR
$43B
Optical Interconnect
15.4% CAGR
165%
Data Center Power Demand Growth
150kW
Max AI Rack Density 2026
$3.7B
CXL Component Market

The Interconnect Layer Is Where
Billion-Dollar Outcomes Are Created

Comparable acquisitions and valuations prove the market is paying premium prices for AI interconnect companies.

XConn Technologies
$540M
Acquired by Marvell
CXL/PCIe Switches
Celestial AI
$3.25B
Acquired by Marvell
Photonic Fabric
Ayar Labs
$3.8B
Valuation (2026)
Photonic Interconnect
Lightmatter
$4.4B
Valuation (2025)
Photonic AI Interconnect

"Datafabrix is building the thermal-aware version of these interconnect products, a category no other company currently occupies. We serve all three explosive growth curves: PCIe Gen6, CXL 3.0, and Liquid Cooling, simultaneously."

Built For & Validated With
NVIDIA
AMD
MARVELL
BROADCOM
SUPERMICRO
QUANTA

Latest from Datafabrix

View All →

Build the Future of AI
Infrastructure With Us

Whether you are designing the next-generation AI training cluster or investing in the companies that will define the compute era.

Request Technical Specs