Datafabrix was founded to remove thermal limits from next-generation AI infrastructure. We design the interconnect layer where signal integrity, cooling, and operational reliability converge.
AI deployments are scaling faster than traditional interconnect and cooling assumptions can handle. Datafabrix exists to make dense AI infrastructure stable, efficient, and deployable at production scale.
We combine thermal-first hardware design, embedded telemetry, and rack-level orchestration into one system so operators can increase density without taking on hidden reliability risk.
Backplanes and chassis engineered around real operating temperatures, not room-temperature lab conditions.
ThermalSense and ThermalOS provide visibility and predictive insight from the edge to the control plane.
Built for PCIe, CXL, and next-wave AI systems that need flexibility as standards evolve.
AI racks now exceed the limits of air-cooled assumptions that governed older compute infrastructure.
As link speeds rise, thermal effects directly erode channel margin and operational stability.
Cooling overhead becomes a major cost center unless the interconnect layer is designed with heat in mind.
Dubai HQ: DTEC, Silicon Oasis
US R&D: Palo Alto, California
Datafabrix is built for teams dealing with rack density, thermal margins, and deployment risk. Start with an architecture review and route the conversation to the right group immediately.