Eight hardware and software products spanning PCIe Gen4 through co-packaged optics. Every one is designed with thermal intelligence from day one.
64 GT/s, 256-lane orthogonal backplane with embedded thermal channels. The world’s first thermally integrated Gen6 solution.
View Product →Validated 32 GT/s thermal-aware backplane for current-generation AI and HPC deployments that still need upgrade headroom.
View Product →Memory disaggregation backplane with thermally zoned DRAM cooling. Enables 128 TiB memory pools across hosts.
View Product →Targeting H1 2027. Open GPU-to-GPU interconnect for 256-accelerator AI pods, built thermal-first for dense scale-up fabrics.
Register Interest →Targeting H2 2027. Copper plus co-packaged optics for 51.2 Tbps aggregate bandwidth when electrical channels hit their practical limit.
Register Interest →Pre-plumbed 100kW liquid cooling chassis subsystem. Drop-in solution with stainless manifold, leak detection, and thermal backplane.
View Product →Embedded ARM Cortex-M33 thermal intelligence MCU. Eight-point sensing, TinyML anomaly detection, 30s predictive alerts.
View Product →AI-driven thermal management SaaS with a real-time 3D digital twin, predictive anomaly detection, and workload placement APIs.
Request Beta Access →Whether you need detailed product specifications, evaluation hardware access, or guidance on the right deployment path, the Datafabrix team can help you map the stack to your AI infrastructure roadmap.